33~37 GHz GaAs功率放大器 MMIC设计
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(中科芯集成电路有限公司,江苏无锡 214000)

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TN722. 75;TN927. 2

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Design of 33–37 GHz GaAs Power Amplifier MMICs
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(China Key System & Integrated Circuit Co.,Ltd,Wuxi,Jiangsu 214000,P. R. China)

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    摘要:

    基于 0. 15 μm GaAs pHEMT工艺设计了两款 33~37 GHz 34 dBm微波单片功率放大器,在功率合成结构上分别采用了簇丛式合成和 “Bus-bar”总线型 2种结构,重点对比了上述 2种方案的幅相一致性对输出性能的影响,并进行了设计流片及测试。两款功率放大器均采用三级级联,通过增益补偿技术,实现了工作频段内稳定平坦的输出。测试结果表明,两款芯片在漏极 6V供电条件下,33~37 GHz工作频带内实现了 20 dB的功率增益,饱和输出功率分别达 33. 7 dBm和 34 dBm以上,功率附加效率 PAE在 23. 8%~29. 7%之间,芯片的面积均为 3.0 mm×2.4 mm。

    Abstract:

    Two 33–37 GHz microwave monolithic integrated circuit(MMIC)power amplifiers with output power of 34 dBm were designed on the basis of a 0. 15-μm gallium arsenide(GaAs)pseudomorphic high electron mobility transistor(pHEMT)process. Cluster-followed synthesis and a "bus bar" structure were designed to realize power combination. Furthermore,the impact of amplitude and phase consistency on output performance were compared and analyzed. Design,tape-out,and testing were performed as well for these two schemes. Both power amplifier designs adopt a cascade structure with three stages achieving stable and flat output in the working frequency band through gain compensation technology. Test results show that under a 6-V power supply condition,the power gain was more than 20 dB with saturation output power exceeding 33. 7 dBm and 34 dBm respectively,and power-added efficiency(PAE) in the range 33–37 GHz,with a chip area of 3. 0 mm×2. 4 mm.

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  • 收稿日期:2024-11-11
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  • 在线发布日期: 2026-01-27
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