基于硅桥芯片互连的芯粒集成技术研究进展
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(中国电子科技集团公司第五十八研究所, 无锡 214035)

作者简介:

袁 渊 (1991—),男(汉族),江苏丹阳人,博士,高级工程师,从事晶圆级扇出型封装研究工作。

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TN305.94

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Progress on Embedded Bridge Packaging for Chiplet Integration
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(The 58th Research Institute of CETC, Wuxi, Jiangsu 214035, P. R. China)

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    摘要:

    在后摩尔时代,通过先进封装技术将具有不同功能、不同工艺节点的异构芯粒实现多功能、高密度、小型化集成是延长摩尔定律寿命的有效方案之一。在众多先进封装解决方案中,在基板或转接板中内嵌硅桥芯片不仅能解决芯粒间局域高密度信号互连问题,而且相较于TSV转接板方案,其成本相对较低。因此,基于硅桥芯片互连的异构芯粒集成技术被业内认为是性能和成本的折中。总结分析了目前业内典型的基于硅桥芯片互连的先进集成技术,介绍其工艺流程和工艺难点,最后展望了该类先进封装技术的发展。

    Abstract:

    During the post-Moore law period, one of the most effective means to delay the life of Moore’s law is achieving multifunctional, high-density, and miniaturized integration of functional and heterogeneous chiplets through advanced packaging technology. Among these blossoming solutions, embedding a silicon bridge chip into a substrate or interposer can solve the problem of local high-density signal interconnection between chiplets at a relatively lower cost than the through silicon via(TSV) interposer. Therefore, embedded bridge packaging is considered a compromise between the performance and cost of chiplets and heterogeneous integration in the industry. Several typically advanced packaging solutions based on bridge interconnection in the industry are summarized in this paper, and their process flow and technical difficulties are presented. Finally, the developmental direction of this type of advanced packaging technology is described.

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  • 收稿日期:2023-10-08
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  • 在线发布日期: 2024-06-27
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