K1-5型外壳共晶贴片热应力研究
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(中国电子科技集团公司第二十四研究所, 重庆 400060)

作者简介:

李金龙(1984—),男(汉族),甘肃秦安人,高级工程师,从事微电子封装工艺研究工作。

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中图分类号:

TN305.94

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模拟集成电路国家级重点实验室基金资助项目(614280204030217)


Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell
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(The 24th Research Institute of China Electronics Technology Group Corp. Chongqing 400060, P. R. China)

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    摘要:

    针对采用10号钢为基材的K1-5型外壳的芯片裂纹问题,对其共晶应力进行了仿真,并尝试对工艺过程进行仿真优化。结果表明,无论采用何种缓慢或快速的散热方式,都不能从根本上改变10号钢与Si芯片因热膨胀系数的巨大差异而导致的热应力。通过比较三种不同的管壳材料可知,以可伐材料为基体的K1-5管壳的共晶热应力最低,为316 MPa,而以10号钢为基体的热应力最高,为19 800 MPa,远远超出了硅芯片的极限断裂强度544 MPa。根据应力的基本理论,可伐与Si芯片的热膨胀系数的差异最小,无氧铜次之,而10号钢为最大,这也是以10号钢为基体的K1-5管壳在共晶时芯片开裂的根本原因。将管壳基材更换为可伐材料,仿真分析和实际试验结果均证明该管壳能够有效解决芯片开裂的问题。

    Abstract:

    Aiming at the chip crack problem of K1-5 shell using No. 10 steel as the substrate, the eutectic stress was simulated, and the procedure was optimized. The results show that no matter how slow or fast heat dissipation is adopted, the thermal stress caused by the huge difference in thermal expansion coefficient between No. 10 steel and Si chip can not be fundamentally changed. By comparing three different shell materials, it can be seen that the thermal stress of the K1-5 shell with Kovar material as the matrix is the lowest, 316 MPa, while the No. 10 steel is the highest, 19 800 MPa, far beyond the limit breaking strength of silicon chip 544 MPa. According to the basic theory of stress, and comparing the difference between the thermal expansion coefficient of the three materials and Si chip, it is found that the difference in the thermal expansion coefficient of Kovar and Si chip is the smallest, followed by oxygen-free copper, and No. 10 steel is the largest, which is the fundamental reason for chip cracking when sintering K1-5 shell with No. 10 steel as the matrix. From simulation analysis and practical experiments, it has been proved that replacing the shell with Kovar material can effectively solve the problem of chip cracking.

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  • 收稿日期:2023-02-26
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  • 在线发布日期: 2023-12-08
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